Release time:2025-11-04  Hits:

• Impact Factor:4.352
• DOI number:10.13580/j.cnki.fstc.2023.03.019
• Journal:Forum on Science and Technology in China
• Key Words:integrated circuit; international trade; social network; spatial pattern; interdependence
• Abstract:As the core of the electronic information technology industry, integrated circuits have become the focus of global competition in core and key technologies. Based on the data of global integrated circuit trade in UN Comtrade Database, this paper establishes a network matrix, and with the help of social network and spatial analysis methods, portrays the evolution of global integrated circuit trade network structure, and further reveals the interdependence between China and other countries (regions) from 2000-2019. The results show that: 1) Over the past 20 years, the global integrated circuit trade network has shown an overall expansion trend, but its development has been blocked in recent years due to U.S.-China tech war. 2) The global integrated circuit trade network has a significant core-periphery structure characteristic, and the structure changes from “single core” to “dual core”. 3) The geographical pattern of the global integrated circuit trade network has changed a lot. North America was in the core position in 2000, but in 2019, East-Southeast Asia was at the heart of the network. As for the spatial distribution of the global integrated circuit trade network, it mainly included the trade links between the continents with North America as the core in 2000. And in 2019, the pattern changed to intra continental trade links with East-Southeast Asia. 4) While maintaining huge trade links with developed countries, China had owned a low degree of trade intensity index. Besides, countries or regions along the “Belt and Road” and Africa were increasing trade dependence with China. 5) The asymmetry of chip trade dependence between China and other countries in the world was significant, and China was heavily dependent on developed countries.
• Note:扬州大学人文社会科学四级期刊
• First Author:Li Tingzhu
• Indexed by:Research Atricle
• Correspondence Author:Du Debin
• Discipline:Management Science
• First-Level Discipline:Business Administration
• Document Type:CSSCI
• Issue:3
• Page Number:93-103
• ISSN No.:1002-6711
• Translation or Not:no
• CN No.:11-1344/G3
• Date of Publication:2023-03-05