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一种射流-直流耦合微通道热沉散热系统

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Affilication of Author(s):扬州大学

School Sign:扬州大学

Disigner of the Invention:程立文

Patent description:一种射流-直流耦合微通道热沉散热系统

Type of Patent:发明

Application Number:202510640150.7

Number of Inventors:8

Service Invention or Not:no

Application Date:2025-05-19

First Author:CLW

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