正高级
Supervisor of Master's Candidates
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Affilication of Author(s):扬州大学
School Sign:扬州大学
Disigner of the Invention:程立文
Patent description:一种高功率半导体激光巴条封装结构
Type of Patent:发明
Application Number:202411010844.4
Number of Inventors:9
Service Invention or Not:no
Application Date:2024-07-26
First Author:CLW
